Amkor Technology, Inc. Equity-NMS: AMKR

Technology

Semiconductor Equipment & Materials

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Previous close :

$22.87

Open :

$22.91

Today's high :

$23.17

Today's low :

$22.68

52W low :

$13.9689

52W high :

$32.8637

EPS(TTM): :

1.26

Shares O/S :

247.14 M

Market cap :

5.68 B

What is the share price of Amkor Technology, Inc. today?

Amkor Technology, Inc. (AMKR) share price as of January 1, 1970, is $. If you are investing from India, you can always check the valuation in the INR before investing.

Can Indian Investors purchase shares of Amkor Technology, Inc.?

Yes, Indian Investors can invest in the Amkor Technology, Inc. (AMKR) Share by opening an international trading account with Angel One.

How can I purchase Amkor Technology, Inc. shares in India?

Purchasing Amkor Technology, Inc. (AMKR) share from India can be done by:

Directly: By opening an international trading account with Angel One. The process would include KYC verification.
The account activation takes a few minutes to a few hours, after which you can start buying Amkor Technology, Inc. (AMKR) by making deposits in US dollars.
Indirectly: By investing in mutual funds and Exchange Traded Funds (ETF) that offers exposure in global stocks.

Can I buy Fractional shares of Amkor Technology, Inc.?

Yes, you can purchase fractional shares of Amkor Technology, Inc. (AMKR) or any other US company shares in Angel One for any dollar amount.

What is the market capitalization value of Amkor Technology, Inc.?

The market capitalization of Amkor Technology, Inc. on January 1, 1970, is $0.

What documents are required to invest in Amkor Technology, Inc. stocks?

In order to invest in Amkor Technology, Inc. (AMKR) you will need Proof of Identification (Aadhaar, PAN, Passport etc.) and Proof of Address (Aadhaar, Voter Card etc.)

From start to end, the process is digital and can be seamless.

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.